Description
1.1 This practice covers procedures for determining operating regions that are safe from metallization burnout induced by current pulses of less than 1-s duration.
Note 1–In this practice, “metallization” refers to metallic layers on semiconductor components such as interconnect patterns on integrated circuits. The principles of the practice may, however, be extended to nearly any current-carrying path. The term “burnout” refers to either fusing or vaporization.
Product Details
- Published:
- 05/01/2013
- Number of Pages:
- 5
- File Size:
- 1 file , 99 KB
Related products
-
Sale!
ASTM Volume 15.07:2018
Original price was: $295.00.$147.50Current price is: $147.50. Add to cart -
Sale!
ASTM WELDING10 / WELDINGCD10
Original price was: $475.00.$237.50Current price is: $237.50. Add to cart -
Sale!
ASTM Volume 15.09:2018
Original price was: $100.00.$50.00Current price is: $50.00. Add to cart -
Sale!
ASTM Volume 15.06:2017
Original price was: $223.00.$111.50Current price is: $111.50. Add to cart