Description
Published annually in April.
This volume contains 148 standards.
Subjects cover:
- Innerlayer Interconnections and Bonding
- Materials and Processes for Vacuum Tubes
- Electronic Device Characterization
- Hermetic Seals
- Hybrid Circuits and Substrates
- Microelectronic Packaging
- Leak Testing
- and more
- This volume also includes the latest standards relating to
- Declarable substances in materials
- 3D imaging systems
- Additive manufacturing technologies
Product Details
- Published:
- 04/01/2019
- ISBN(s):
- 9781682215678
- Number of Pages:
- 1164
